d/crcw-hr e3 www.vishay.com vishay revision: 12-jun-12 1 document number: 20022 for technical questions, contact: thickfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 lead (pb)-free thick film, rectangular high value chip resistor features ? high resistance va lues (up to 470m) ? suitable for voltage dividers and hybrids ? pure tin plating provides compatibility with lead (pb)-free and lead containing soldering processing ? metal glaze on high quality ceramic ? material categorization: for definitions of compliance please see www.vishay.com/doc?99912 notes ? these resistors do not feature a limited lifetime when operated within the limits of rated di ssipation, permissible operating voltage, and permissible film temperature. however, the resistance typically increase due to the resistors film temperature over operating time, generally known as drift. the drift may exceed the stability requirements of an individual application circuit and thereby limits the fun ctional time. ? marking and packaging: see datasheet surface mount resistor marking ( www.vishay.com/doc?20020 ) ? power rating depends on the max. temperat ure at the solder point, the component pl acement density and the substrate material. note (1) the power dissipation on the resistor generates a temperature rise against the local ambient, depe nding on the heat flow suppor t of the printed-circuit bo ard (thermal resistance). the rated di ssipation applie s only if the permitted film temperature of 155 c is n ot exceeded. standard electrical specifications model case size inch case size metric power rating p 70 w limiting element voltage u max. ac rms /dc v temperature coefficient ppm/k tolerance % resistance range ? series d11/crcw0603-hr 0603 rr 1608m 0.10 75 500 5 11m to 470m e24 d12/crcw0805-hr 0805 rr 2012m 0.125 150 500 5 11m to 470m e24 d25/crcw1206-hr 1206 rr 3216m 0.25 200 500 5 11m to 470m e24 technical specifications parameter unit d11/crcw0603-hr d 12/crcw0805-hr d 25/crcw1206-hr rated dissipation at p 70 (1) w 0.1 0.125 0.25 operating voltage u max. ac rms /dc v 75 150 200 voltage coefficient %/v < 100m: < 0.1 > 100m: < 0.3 insulation voltage u ins (1 min) v 100 200 300 insulation resistance ? > 10 9 operating temperature range c - 55 to + 155 weight mg 2 5.5 10
d/crcw-hr e3 www.vishay.com vishay revision: 12-jun-12 2 document number: 20022 for technical questions, contact: thickfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 dimensions part number and product description part number: crcw060316m0jpeahr model/size resistance tolerance tcr packaging special crcw0603 crcw0805 crcw1206 m = million j = 5 % p = 500 ppm/k ea eb ec up to 2 digits hr = high value product description: d11/cr cw0603-hr 500 16m 5 % et1 e3 d11/crcw0603-hr 500 16m 5 % et1 e3 model tcr resistance tolerance packaging lead (pb)-free d11/crcw0603-hr d12/crcw0805-hr d25/crcw1206-hr 500 ppm/k 68m = 68 m ? 227m = 227 m ? 5 % et1 et5 et6 e3 = pure tin termination finish packaging model code quantity carrier tape width pitch reel diameter d11/crcw0603-hr ea = et1 5000 paper tape acc. to iec 60068-3 type i 8 mm 4 mm 180 mm/7" eb = et5 10 000 285 mm/11.25" ec = et6 20 000 330 mm/13" d12/crcw0805-hr ea = et1 5000 8 mm 4 mm 180 mm/7" eb = et5 10 000 285 mm/11.25" ec = et6 20 000 330 mm/13" d25/crcw1206-hr ea = et1 5000 8 mm 4 mm 180 mm/7" eb = et5 10 000 285 mm/11.25" ec = et6 20 000 330 mm/13" size dimensions in millimeters solder pad dimensions in millimeters reflow soldering wave soldering inch metric l w h t1 t2 a b l a b l 0603 1608 1.55 + 0.10 - 0.05 0.85 0.1 0.45 0.05 0.3 0.2 0.3 0.2 0.5 0.9 1.0 0.9 0.9 1.0 0805 2012 2.0 + 0.20 - 0.10 1.25 0.15 0.45 0.05 0.3 + 0.10 - 0.20 0.3 0.2 0.7 1.3 1.2 0.9 1.3 1.3 1206 3216 3.2 + 0.10 - 0.20 1.6 0.15 0.55 0.05 0.45 0.2 0.4 0.2 0.9 1.7 2.0 1.1 1.7 2.3 c r c w 0 6 0 3 1 6 m 0 j p e a h r
d/crcw-hr e3 www.vishay.com vishay revision: 12-jun-12 3 document number: 20022 for technical questions, contact: thickfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 derating test procedures and requirements en 60115-1 ? clause iec 60068-2 test method test procedure requirements permissible change ( ? r ) stability class 2 or better stability for product types: d/crcw-hr e3 11 m ? to 470 m ? 4.5 _ resistance - 5 % 4.13 _ short time overload u = 2.5 x p 70 x r ? 2 x u max. ; duration acc. to style (0.5 % r + 0.05 ? ) 4.17.2 58 (td) solderability solder bath method; sn60pb40 good tinning ( ? 95 % covered); no visible damage solder bath method; sn96, 5ag3cu0.5 or sn99, 3cu0.7 non-activated flux; (245 5) c or (250 5) c (3 0.3) s good tinning ( ? 95 % covered); no visible damage 4.8.4.2 _ temperature coefficient 20 c/- 55 c/20 c and 20 c/125 /20 c 500 ppm/k 4.32 21 (uu 3 ) shear (adhesion) rr 1608: 9 n rr 2012 and rr 3216: 45n no visible damage 4.33 21 (uu 1 ) substrate bending depth 2 mm; 3 times no visible damage, no open circuit in bent position (0.25 % r + 0.05 ? ) 4.19 14 (na) rapid change of temperature 30 min. at - 55 c; 30 min. at 125 c 5 cycles 1000 cycles (0.5 % r + 0.05 ? ) (1 % r + 0.05 ? ) 4.23 4.23.2 4.23.3 4.23.4 4.23.5 4.23.6 4.23.7 _ 2 (ba) 30 (db) 1 (aa) 13 (m) 30 (db) _ climatic sequence: dry heat damp heat, cyclic cold low air pressure damp heat, cyclic d.c. load - 125 c; 16 h 55 c; ? 90 % rh; 24 h; 1 cycle - 55 c; 2 h 1 kpa; (25 10) c; 1 h 55 c; ? 90 % rh 24 h; 5 cycle u = p 70 x r (2 % r + 0.1 ? ) ambient temperature in amb fraction of rated dissipation p 70 - 50 0 50 100 150 0 50 100 70 c %
d/crcw-hr e3 www.vishay.com vishay revision: 12-jun-12 4 document number: 20022 for technical questions, contact: thickfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 all tests are carried out in accordance with the following specifications: ? en 60115-1, generic specification ? en 140400, sectional specification ? en 140401-802, detail specification ? iec 60068-2-x, variety of en vironmental test procedures packaging of components is do ne in paper or blister tape s according to iec 60286-3. 4.25.1 _ endurance at 70 c u = p 70 x r ? u max. 1.5 h on; 0,5 h off; 70 c; 1000 h 70 c; 8000 h (2 % r + 0.1 ? ) (4 % r + 0.1 ? ) 4.18.2 58 (td) resistance to soldering heat solder bath method (260 5) c; (10 1) s (0.5 % r + 0.05 ? ) 4.24 78 (cab) damp heat, steady state (40 2) c; (93 3) % rh; 56 days (2 % r + 0.1 ? ) 4.25.3 _ endurance at upper category temperature 155 c; 1000 h (2 % r + 0.1 ? ) test procedures and requirements en 60115-1 ? clause iec 60068-2 test method test procedure requirements permissible change ( ? r ) stability class 2 or better stability for product types: d/crcw-hr e3 11 m ? to 470 m ?
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